MAIN FEATURES
Electron source Schottky thermal field emitter
Ion source Gallium liquid metal
Beam voltage
200 V – 30 kV SEM
2 kV – 30 kV FIB
Image resolution < 0.8 nm achievable SEM-STEM mode
Detectors: ETD TLD CDEM
Accessories: Autoprobe 200 support PC water chiller Oneac transformer
Sample types Wafer pieces, packaged parts, TEM half-grids Max sample size 75 mm diameter, loadlock compatible Flipstage Removable Row Holder holds up to six TEM grids Total tilt range > 150 degrees (excluding tilt of main
DualBeam stage)
External load base for loading/unloading grids from row
holder
In-situ section extraction system
SEM-STEM detector Multi-region: bright field, dark field, 12 high-angle dark
field segments
User interface Windows 2000® GUI with integrated SEM, FIB, GIS,
imaging and patterning
Simultaneous patterning and imaging mode
